INTEL Xeon 5317 3.00GHz CPU
The Intel Xeon Gold 5317 is a 12-core, 24-thread processor from the 3rd-Generation Intel Xeon Scalable family (Ice Lake-SP), built on a 10 nm process and clocked at 3.00 GHz base with up to 3.60 GHz turbo. It targets system integrators and data centers building dual-socket virtualization hosts, cloud nodes, storage controllers, and edge servers. Note that this is a Socket LGA4189 (FCLGA4189) part, so platform compatibility must be verified before purchase.
Key specifications (table)
| Parameter | Specification |
| Product Family | 3rd-Generation Intel Xeon Scalable (Ice Lake-SP) |
| Model | Intel Xeon Gold 5317 |
| Cores / Threads | 12 / 24 |
| Base Frequency | 3.00 GHz |
| Max Turbo Frequency | 3.60 GHz |
| L3 Cache | 18 MB |
| Process Node | 10 nm |
| Socket | FCLGA4189 (LGA 4189) — Ice Lake-SP platform dependent |
| TDP | 150 W — verify server cooling and power provisioning |
| Memory Type | DDR4-2933 (ECC supported) |
| Memory Channels | Up to 8 channels |
| Max Memory per Socket | Up to 6 TB (platform dependent) |
| PCI Express | PCIe 4.0; up to 64 lanes (platform dependent) |
| UPI Links | 3 links, 11.2 GT/s each |
| Max SMP Configuration | Dual-socket (2 CPUs per system) |
| Instruction Set & Extensions | 64-bit ISA; AVX, AVX2, AVX-512, AES-NI, SSE4.2, TSX-NI, etc. |
| Special Features | Intel Deep Learning Boost, Resource Director Technology, Speed Select, ECC memory, VT-x / VT-d virtualization, hardware reliability features |
| Application Areas | Virtualization, cloud servers, mid-range servers, storage controllers, edge servers, enterprise workloads |
Good to know
- Compatibility: requires an Ice Lake-SP (3rd-Gen Xeon Scalable) motherboard with Socket LGA4189 and appropriate BIOS support; it is not interchangeable with Copper Lake or Cascade Lake (LGA3647) platforms.
- Family positioning: within the Gold 53xx tier, the 5317 balances core count and frequency for mid-range deployments, sitting below higher-core-count Gold 6300/8300 SKUs while retaining the same 8-channel DDR4 and PCIe 4.0 I/O.
- Buying tip: confirm your chassis supports a 150 W TDP and plan DIMM population across all 8 memory channels to fully realize the DDR4-2933 bandwidth; for dual-socket builds, matched stepping/revision parts are recommended.
For tray and reel pricing, current stock by part number and date code, and volume discounts on bulk orders, request a bulk quotation.
The Intel Xeon Gold 5317 is a 12-core, 24-thread processor from the 3rd-Generation Intel Xeon Scalable family (Ice Lake-SP), built on a 10 nm process and clocked at 3.00 GHz base with up to 3.60 GHz turbo. It targets system integrators and data centers building dual-socket virtualization hosts, cloud nodes, storage controllers, and edge servers. Note that this is a Socket LGA4189 (FCLGA4189) part, so platform compatibility must be verified before purchase.
Key specifications (table)
| Parameter | Specification |
| Product Family | 3rd-Generation Intel Xeon Scalable (Ice Lake-SP) |
| Model | Intel Xeon Gold 5317 |
| Cores / Threads | 12 / 24 |
| Base Frequency | 3.00 GHz |
| Max Turbo Frequency | 3.60 GHz |
| L3 Cache | 18 MB |
| Process Node | 10 nm |
| Socket | FCLGA4189 (LGA 4189) — Ice Lake-SP platform dependent |
| TDP | 150 W — verify server cooling and power provisioning |
| Memory Type | DDR4-2933 (ECC supported) |
| Memory Channels | Up to 8 channels |
| Max Memory per Socket | Up to 6 TB (platform dependent) |
| PCI Express | PCIe 4.0; up to 64 lanes (platform dependent) |
| UPI Links | 3 links, 11.2 GT/s each |
| Max SMP Configuration | Dual-socket (2 CPUs per system) |
| Instruction Set & Extensions | 64-bit ISA; AVX, AVX2, AVX-512, AES-NI, SSE4.2, TSX-NI, etc. |
| Special Features | Intel Deep Learning Boost, Resource Director Technology, Speed Select, ECC memory, VT-x / VT-d virtualization, hardware reliability features |
| Application Areas | Virtualization, cloud servers, mid-range servers, storage controllers, edge servers, enterprise workloads |
Good to know
- Compatibility: requires an Ice Lake-SP (3rd-Gen Xeon Scalable) motherboard with Socket LGA4189 and appropriate BIOS support; it is not interchangeable with Copper Lake or Cascade Lake (LGA3647) platforms.
- Family positioning: within the Gold 53xx tier, the 5317 balances core count and frequency for mid-range deployments, sitting below higher-core-count Gold 6300/8300 SKUs while retaining the same 8-channel DDR4 and PCIe 4.0 I/O.
- Buying tip: confirm your chassis supports a 150 W TDP and plan DIMM population across all 8 memory channels to fully realize the DDR4-2933 bandwidth; for dual-socket builds, matched stepping/revision parts are recommended.
For tray and reel pricing, current stock by part number and date code, and volume discounts on bulk orders, request a bulk quotation.
