INTEL Xeon 6150 2.70GHz CPU
The Intel Xeon Gold 6150 is an 18-core, 36-thread server processor from the first-generation Xeon Scalable family (Gold 6100 series, Skylake-SP), built for high-density virtualization, HPC clusters, and enterprise cloud nodes. With a 2.70 GHz base and 3.70 GHz turbo clock, it suits buyers consolidating multi-VM workloads or running compute- and memory-heavy applications. Note that deployment requires an LGA 3647 platform with appropriate cooling for its 165 W TDP.
Key specifications (table)
| Parameter | Specification |
|---|---|
| Model | Intel Xeon Gold 6150 |
| Processor Family | Xeon Scalable (Gold 6100 Series) |
| Microarchitecture | Skylake-SP |
| Manufacturing Process | 14 nm |
| Total Cores | 18 |
| Total Threads | 36 |
| Base Clock Frequency | 2.70 GHz |
| Max Turbo Frequency | 3.70 GHz |
| L1 Cache | 18 × 64 KB (instruction + data per core) |
| L2 Cache | 18 × 1 MB = 18 MB |
| L3 Cache | 24.75 MB shared |
| TDP | 165 W (verify server cooling and PSU headroom) |
| Socket | LGA 3647 (platform dependent) |
| Memory Type | DDR4-2666 ECC |
| Memory Channels | 6 |
| Max Memory Capacity | Up to 768 GB per socket (platform dependent) |
| PCI Express Lanes | 48 lanes (PCIe 3.0) |
| UPI Links | 3 links |
| Instruction Set Extensions | SSE4.2, AVX, AVX2, AVX-512 (dual FMA units) |
| Virtualization Support | VT-x, VT-d |
| Security Features | Intel SGX, AES-NI, Boot Guard, TXT |
| Reliability Features (RAS) | Enhanced ECC, memory mirroring, machine check recovery |
| Launch Year | 2017 |
| Typical Deployment | High-density virtualization, HPC clusters, enterprise cloud servers |
Good to know
- Requires an LGA 3647 (Socket P) motherboard; confirm BIOS support and VRM/cooling compliance with the 165 W TDP before pairing with C620-series or equivalent platforms.
- Within the Gold 6100 series, the 6150 sits at the higher core count end, offering more cores than entry Gold parts while remaining below Platinum-tier scalability; its 3 UPI links support multi-socket (2S+) configurations.
- As a first-generation Scalable part, verify firmware compatibility and consider that newer-generation platforms may offer better performance per watt — match the CPU to an existing LGA 3647 chassis and heatsink inventory when buying for spare-part or expansion purposes.
For tray and reel pricing, current stock by part number and date code, and volume discounts on bulk orders, request a bulk quotation.
The Intel Xeon Gold 6150 is an 18-core, 36-thread server processor from the first-generation Xeon Scalable family (Gold 6100 series, Skylake-SP), built for high-density virtualization, HPC clusters, and enterprise cloud nodes. With a 2.70 GHz base and 3.70 GHz turbo clock, it suits buyers consolidating multi-VM workloads or running compute- and memory-heavy applications. Note that deployment requires an LGA 3647 platform with appropriate cooling for its 165 W TDP.
Key specifications (table)
| Parameter | Specification |
|---|---|
| Model | Intel Xeon Gold 6150 |
| Processor Family | Xeon Scalable (Gold 6100 Series) |
| Microarchitecture | Skylake-SP |
| Manufacturing Process | 14 nm |
| Total Cores | 18 |
| Total Threads | 36 |
| Base Clock Frequency | 2.70 GHz |
| Max Turbo Frequency | 3.70 GHz |
| L1 Cache | 18 × 64 KB (instruction + data per core) |
| L2 Cache | 18 × 1 MB = 18 MB |
| L3 Cache | 24.75 MB shared |
| TDP | 165 W (verify server cooling and PSU headroom) |
| Socket | LGA 3647 (platform dependent) |
| Memory Type | DDR4-2666 ECC |
| Memory Channels | 6 |
| Max Memory Capacity | Up to 768 GB per socket (platform dependent) |
| PCI Express Lanes | 48 lanes (PCIe 3.0) |
| UPI Links | 3 links |
| Instruction Set Extensions | SSE4.2, AVX, AVX2, AVX-512 (dual FMA units) |
| Virtualization Support | VT-x, VT-d |
| Security Features | Intel SGX, AES-NI, Boot Guard, TXT |
| Reliability Features (RAS) | Enhanced ECC, memory mirroring, machine check recovery |
| Launch Year | 2017 |
| Typical Deployment | High-density virtualization, HPC clusters, enterprise cloud servers |
Good to know
- Requires an LGA 3647 (Socket P) motherboard; confirm BIOS support and VRM/cooling compliance with the 165 W TDP before pairing with C620-series or equivalent platforms.
- Within the Gold 6100 series, the 6150 sits at the higher core count end, offering more cores than entry Gold parts while remaining below Platinum-tier scalability; its 3 UPI links support multi-socket (2S+) configurations.
- As a first-generation Scalable part, verify firmware compatibility and consider that newer-generation platforms may offer better performance per watt — match the CPU to an existing LGA 3647 chassis and heatsink inventory when buying for spare-part or expansion purposes.
For tray and reel pricing, current stock by part number and date code, and volume discounts on bulk orders, request a bulk quotation.
