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INTEL Xeon 6328HL 2.80GHz CPU

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$4,779.00$4,768.00
Disponibilidad: En stock
SKU: 4389

The Intel Xeon Gold 6328HL is a high-memory-optimized processor from the 3rd Generation Intel Xeon Scalable family (Ice Lake-SP), built for buyers deploying cloud, virtualization, and memory-intensive database workloads. With 28 cores and 56 threads, it targets system integrators and data center operators who need dense compute with large memory addressing. Note that this H-series SKU requires a compatible FCLGA4189 platform, so verify mainboard and BIOS support before ordering.

Key specifications (table)

Parameter Specification
Product Family 3rd Generation Intel Xeon Scalable
Model Xeon Gold 6328HL
Cores / Threads 28 / 56
Base Frequency 2.70 GHz
Maximum Turbo Frequency 4.00 GHz
L3 Cache 38.5 MB
Architecture Ice Lake-SP
Socket FCLGA4189 (dual-socket capable)
TDP 205 W (plan chassis airflow and PSU sizing accordingly)
Memory Type DDR4 ECC
Memory Speed Up to DDR4-3200
Memory Channels 8 or more (high-memory optimized)
Maximum Memory Capacity Platform dependent (high memory capacity support)
PCIe Version PCIe 4.0 (platform dependent)
Instruction Extensions AVX, AVX2, AVX-512, AES-NI, SSE4.2
Virtualization Support Intel VT-x, Intel VT-d
Reliability Features Enterprise RAS capabilities
Recommended Use Cases Cloud servers, virtualization nodes, high-memory database servers, AI inference, analytics, enterprise applications

Good to know

  • This CPU only fits Ice Lake-SP era FCLGA4189 sockets; it is not drop-in compatible with earlier Cascade Lake or later Sapphire Rapids Xeon Scalable platforms, so confirm server model support (e.g. HPE, Dell, Lenovo generation) before purchase.
  • The “HL” designation marks the high-memory variant within the Gold 6300 series, positioned above the standard-memory SKUs for large-footprint database and analytics deployments; the H suffix relates to high-memory platform support rather than higher clocks.
  • Because TDP is 205 W, verify your server’s thermal profile supports this SKU class; buyers running virtualization or VE-DIMM-heavy memory configurations should match the board’s validated memory support list.

For tray and reel pricing, current stock by part number and date code, and volume discounts on bulk orders, request a bulk quotation.


Categorías:

The Intel Xeon Gold 6328HL is a high-memory-optimized processor from the 3rd Generation Intel Xeon Scalable family (Ice Lake-SP), built for buyers deploying cloud, virtualization, and memory-intensive database workloads. With 28 cores and 56 threads, it targets system integrators and data center operators who need dense compute with large memory addressing. Note that this H-series SKU requires a compatible FCLGA4189 platform, so verify mainboard and BIOS support before ordering.

Key specifications (table)

Parameter Specification
Product Family 3rd Generation Intel Xeon Scalable
Model Xeon Gold 6328HL
Cores / Threads 28 / 56
Base Frequency 2.70 GHz
Maximum Turbo Frequency 4.00 GHz
L3 Cache 38.5 MB
Architecture Ice Lake-SP
Socket FCLGA4189 (dual-socket capable)
TDP 205 W (plan chassis airflow and PSU sizing accordingly)
Memory Type DDR4 ECC
Memory Speed Up to DDR4-3200
Memory Channels 8 or more (high-memory optimized)
Maximum Memory Capacity Platform dependent (high memory capacity support)
PCIe Version PCIe 4.0 (platform dependent)
Instruction Extensions AVX, AVX2, AVX-512, AES-NI, SSE4.2
Virtualization Support Intel VT-x, Intel VT-d
Reliability Features Enterprise RAS capabilities
Recommended Use Cases Cloud servers, virtualization nodes, high-memory database servers, AI inference, analytics, enterprise applications

Good to know

  • This CPU only fits Ice Lake-SP era FCLGA4189 sockets; it is not drop-in compatible with earlier Cascade Lake or later Sapphire Rapids Xeon Scalable platforms, so confirm server model support (e.g. HPE, Dell, Lenovo generation) before purchase.
  • The “HL” designation marks the high-memory variant within the Gold 6300 series, positioned above the standard-memory SKUs for large-footprint database and analytics deployments; the H suffix relates to high-memory platform support rather than higher clocks.
  • Because TDP is 205 W, verify your server’s thermal profile supports this SKU class; buyers running virtualization or VE-DIMM-heavy memory configurations should match the board’s validated memory support list.

For tray and reel pricing, current stock by part number and date code, and volume discounts on bulk orders, request a bulk quotation.

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