INTEL Xeon 5217 3.00GHz CPU
The Intel Xeon Gold 5217 is an 8-core, 16-thread processor from the 2nd Generation Intel Xeon Scalable family (Cascade Lake), designed for LGA 3647 platform servers and workstations. With a 3.0 GHz base clock and 125 W TDP, it suits latency-sensitive workloads such as virtualization hosts, application servers, and storage controllers where per-core frequency matters more than core count. Note that deployment requires a C621-series chipset motherboard and appropriate cooling for the 125 W thermal envelope.
Key specifications (table)
| Parameter | Specification |
| Model | Intel Xeon Gold 5217 |
| Processor Family | 2nd Generation Intel Xeon Scalable (Cascade Lake) |
| Cores / Threads | 8 Cores / 16 Threads (with Hyper-Threading) |
| Base Clock Frequency | 3.0 GHz |
| Max Turbo Frequency | 3.7 GHz (Turbo Boost 2.0) |
| L3 Cache | 11 MB |
| TDP | 125 W (verify chassis cooling capacity) |
| Manufacturing Process | 14 nm |
| Socket | LGA 3647 (platform dependent — check motherboard support) |
| Memory Support | DDR4-2666 ECC, 6 channels |
| Maximum Memory Capacity | Up to 1 TB (with RDIMM/LRDIMM) |
| PCI Express | PCIe 3.0, 48 lanes |
| Intel Hyper-Threading | Yes |
| Intel Turbo Boost | Yes (Turbo Boost 2.0) |
| Intel AVX-512 | Yes (1 FMA unit) |
| Virtualization Technologies | Intel VT-x, VT-d, EPT |
| Security Technologies | Intel SGX, AES-NI, Secure Key, OS Guard |
| Maximum Operating Temperature (Tcase) | 78°C |
Good to know
- Compatibility: requires an LGA 3647 socket motherboard with a C621-series chipset; BIOS support for Cascade Lake should be confirmed when upgrading from 1st Generation Xeon Scalable systems.
- Family positioning: within the Xeon Gold range, the 5217 sits at the higher-frequency, lower-core-count end — it trades core density for clock speed compared with higher-core Gold parts, making it a strong fit for single-thread-sensitive workloads.
- Buying tip: confirm whether your platform supports RDIMM or LRDIMM modules when planning toward the 1 TB memory ceiling, and validate cooling headroom against the 125 W TDP before ordering in volume.
For tray and reel pricing, current stock by part number and date code, and volume discounts on bulk orders, request a bulk quotation.
The Intel Xeon Gold 5217 is an 8-core, 16-thread processor from the 2nd Generation Intel Xeon Scalable family (Cascade Lake), designed for LGA 3647 platform servers and workstations. With a 3.0 GHz base clock and 125 W TDP, it suits latency-sensitive workloads such as virtualization hosts, application servers, and storage controllers where per-core frequency matters more than core count. Note that deployment requires a C621-series chipset motherboard and appropriate cooling for the 125 W thermal envelope.
Key specifications (table)
| Parameter | Specification |
| Model | Intel Xeon Gold 5217 |
| Processor Family | 2nd Generation Intel Xeon Scalable (Cascade Lake) |
| Cores / Threads | 8 Cores / 16 Threads (with Hyper-Threading) |
| Base Clock Frequency | 3.0 GHz |
| Max Turbo Frequency | 3.7 GHz (Turbo Boost 2.0) |
| L3 Cache | 11 MB |
| TDP | 125 W (verify chassis cooling capacity) |
| Manufacturing Process | 14 nm |
| Socket | LGA 3647 (platform dependent — check motherboard support) |
| Memory Support | DDR4-2666 ECC, 6 channels |
| Maximum Memory Capacity | Up to 1 TB (with RDIMM/LRDIMM) |
| PCI Express | PCIe 3.0, 48 lanes |
| Intel Hyper-Threading | Yes |
| Intel Turbo Boost | Yes (Turbo Boost 2.0) |
| Intel AVX-512 | Yes (1 FMA unit) |
| Virtualization Technologies | Intel VT-x, VT-d, EPT |
| Security Technologies | Intel SGX, AES-NI, Secure Key, OS Guard |
| Maximum Operating Temperature (Tcase) | 78°C |
Good to know
- Compatibility: requires an LGA 3647 socket motherboard with a C621-series chipset; BIOS support for Cascade Lake should be confirmed when upgrading from 1st Generation Xeon Scalable systems.
- Family positioning: within the Xeon Gold range, the 5217 sits at the higher-frequency, lower-core-count end — it trades core density for clock speed compared with higher-core Gold parts, making it a strong fit for single-thread-sensitive workloads.
- Buying tip: confirm whether your platform supports RDIMM or LRDIMM modules when planning toward the 1 TB memory ceiling, and validate cooling headroom against the 125 W TDP before ordering in volume.
For tray and reel pricing, current stock by part number and date code, and volume discounts on bulk orders, request a bulk quotation.
