INTEL Xeon 6330 2.00GHz CPU
The Intel Xeon Gold 6330 is a 28-core, 56-thread processor from the 3rd Generation Intel Xeon Scalable family (Ice Lake-SP), suited to buyers building or upgrading dual-socket cloud, virtualization, and storage platforms. Its high core count and AVX-512 support make it a strong fit for virtualization nodes, analytics, and AI inference workloads. Note that memory capacity, PCIe 4.0 support, and overall performance depend on the host platform, so verify motherboard and BIOS compatibility before purchase.
Key specifications (table)
| Parameter | Specification |
|---|---|
| Product Family | 3rd Generation Intel Xeon Scalable (Ice Lake-SP generation, positioned below Platinum in the Gold tier) |
| Model | Xeon Gold 6330 |
| Cores / Threads | 28 / 56 |
| Base Frequency | 2.00 GHz |
| Maximum Turbo Frequency | 3.30 GHz |
| L3 Cache | 38.5 MB |
| Architecture | Ice Lake-SP |
| Socket | FCLGA4189 (dual-socket capable) |
| TDP | 165 W |
| Memory Type | DDR4 ECC |
| Memory Speed | Up to DDR4-3200 |
| Memory Channels | 8 |
| Maximum Memory Capacity | Platform dependent |
| PCIe Version | PCIe 4.0 (platform dependent) |
| Instruction Extensions | AVX, AVX2, AVX-512, AES-NI, SSE4.2 |
| Virtualization Support | Intel VT-x, Intel VT-d |
| Reliability Features | Enterprise RAS capabilities |
| Recommended Use Cases | Cloud servers, virtualization nodes, storage servers, enterprise applications, analytics, AI inference |
Good to know
- Requires an FCLGA4189 (LGA4189) socket motherboard with Ice Lake-SP platform support; DDR4-3200 and PCIe 4.0 operation depend on the specific board and BIOS version, so confirm compatibility before ordering.
- Within the 3rd Gen Xeon Scalable lineup, the 6330 sits in the Gold tier and offers a high core count at a moderate base clock, making it well suited to multi-VM consolidation and throughput-oriented workloads rather than single-threaded applications.
- When sourcing, confirm whether the unit is new, tray, or pull, and verify that your chassis cooling and power budget accommodate the 165 W TDP—especially in dual-socket configurations.
For tray and reel pricing, current stock by part number and date code, and volume discounts on bulk orders, request a bulk quotation.
The Intel Xeon Gold 6330 is a 28-core, 56-thread processor from the 3rd Generation Intel Xeon Scalable family (Ice Lake-SP), suited to buyers building or upgrading dual-socket cloud, virtualization, and storage platforms. Its high core count and AVX-512 support make it a strong fit for virtualization nodes, analytics, and AI inference workloads. Note that memory capacity, PCIe 4.0 support, and overall performance depend on the host platform, so verify motherboard and BIOS compatibility before purchase.
Key specifications (table)
| Parameter | Specification |
|---|---|
| Product Family | 3rd Generation Intel Xeon Scalable (Ice Lake-SP generation, positioned below Platinum in the Gold tier) |
| Model | Xeon Gold 6330 |
| Cores / Threads | 28 / 56 |
| Base Frequency | 2.00 GHz |
| Maximum Turbo Frequency | 3.30 GHz |
| L3 Cache | 38.5 MB |
| Architecture | Ice Lake-SP |
| Socket | FCLGA4189 (dual-socket capable) |
| TDP | 165 W |
| Memory Type | DDR4 ECC |
| Memory Speed | Up to DDR4-3200 |
| Memory Channels | 8 |
| Maximum Memory Capacity | Platform dependent |
| PCIe Version | PCIe 4.0 (platform dependent) |
| Instruction Extensions | AVX, AVX2, AVX-512, AES-NI, SSE4.2 |
| Virtualization Support | Intel VT-x, Intel VT-d |
| Reliability Features | Enterprise RAS capabilities |
| Recommended Use Cases | Cloud servers, virtualization nodes, storage servers, enterprise applications, analytics, AI inference |
Good to know
- Requires an FCLGA4189 (LGA4189) socket motherboard with Ice Lake-SP platform support; DDR4-3200 and PCIe 4.0 operation depend on the specific board and BIOS version, so confirm compatibility before ordering.
- Within the 3rd Gen Xeon Scalable lineup, the 6330 sits in the Gold tier and offers a high core count at a moderate base clock, making it well suited to multi-VM consolidation and throughput-oriented workloads rather than single-threaded applications.
- When sourcing, confirm whether the unit is new, tray, or pull, and verify that your chassis cooling and power budget accommodate the 165 W TDP—especially in dual-socket configurations.
For tray and reel pricing, current stock by part number and date code, and volume discounts on bulk orders, request a bulk quotation.
